Development of a cost estimation model for sla prototyping based on volumetric information

dc.contributor.authorCombrinck, Jacques
dc.contributor.otherBloemfontein: Central University of Technology, Free State
dc.date.accessioned2017-06-01T08:16:34Z
dc.date.available2017-06-01T08:16:34Z
dc.date.issued2005
dc.descriptionThesisen_US
dc.description.abstractThe Stereo lithography process is a well-known process in South Africa and around the world. Quotations for designers and inventors are issued daily for the growing of a prototype of his/her invention or design. Not all the inventors and designers have access io CAD software to transform their design or invention into a solid model. Because of this they cannot submit an .STL file to a Rapid Prototyping service bureau for a quotation. They can only submit a 2D-sketch to the Rapid Prototyping service bureau for a quotation. This study presents a method of calculating build time estimations within a limit of 10% of the actual build time of a prototype. This is achieved by using basic volumetric shapes, such as cylinders and cones, added together to represent the model in the 2Dsketch. By using this information the build time of the product is then calculated with the aid of models created in TK Solver.en_US
dc.format.mimetypeApplication/PDF
dc.identifier.urihttp://hdl.handle.net/11462/1059
dc.language.isoen_USen_US
dc.publisherBloemfontein: Central University of Technology, Free State
dc.rights.holderCentral University of Technology, Free State
dc.subjectCost estimatesen_US
dc.subjectRapid prototypingen_US
dc.subjectMensurationen_US
dc.titleDevelopment of a cost estimation model for sla prototyping based on volumetric informationen_US
dc.typeThesisen_US

Files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
Combrinck, Jacques.pdf
Size:
27.34 MB
Format:
Adobe Portable Document Format
Description:
Thesis

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed upon to submission
Description: